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CMP polishing abrasive
| Ebe nke Si Malite: | China |
| Ika aha: | Semixlab |
| Model Number: | SXL-1 |
| asambodo: | ISO14001, ISO45001, ISO9001 |
| Kacha nta Order ibu: | Isiokwu maka mkparita uka |
| Ahịa: | Kpọtụrụ maka ngụ aha ahaziri |
| Packaging Details: | Ngwungwu mbupụ ọkọlọtọ |
| Oge Mbuga ozi: | Ụbọchị 15-30 mgbe nkwenye iwu gasịrị |
| Ịkwụ Ụgwọ Okwu: | T / T |
| Tụkwasịnụ Ikike: | 10 tọn / ọnwa |
Description
CMP (Chemical Mechanical Planarization) polishing abrasive bụ ihe dị mkpa n'ọhịa nke nrụpụta semiconductor, iko anya, sekit agbakwunyere, wdg, wee nweta ọkwa nano dị elu site na mmetụta synergistic nke corrosion kemịkalụ na igwe igwe.
ngwa:
CMP polishing abrasives bụ ihe dị mkpa dị mkpa na ngalaba nke nrụpụta sekit agbakwunyere na enwere ike iji ya na ILD agbakwunyere, semiconductor monocrystalline silicon wafers, semiconductor silicon carbide, integrated circuit shallow trench kewapụ (STI), polysilicon integrated (Poly - Si), ọla sekit agbakwunyere na akwa mgbochi ọla.
Ọrụ ndị enwere ike ịnye:
nyocha ọnọdụ ngwa ahịa, ihe dakọtara, idozi nsogbu teknụzụ.
Nkọwapụta Ụlọ ọrụ:
Semixlab nwere ụlọ nyocha 2, otu ndị ọkachamara nwere ahụmịhe ihe onwunwe afọ 20, yana R&D na mmepụta, nnwale na ikike nkwenye.
nkọwa
Ngosipụta arụmọrụ maka Ngwaahịa Series Ultra-High Purity
| oke | SXL-1 | SXL-2 | SXL-3 | SXL-4 | SXL-5 | SXL-6 | SXL-7 |
| Nkezi SilicaParticle nha/nm | 35 ± 5 | 45 ± 5 | 65 ± 5 | 75 ± 5 | 85 ± 5 | 100 ± 5 | 120 ± 5 |
| Nkesa Nanoparticle SizeDistribution (PDI) | |||||||
| Ngwọta pH | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 |
| Ọdịnaya siri ike/% | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 |
| ọdịdị | ìhè Blue | Blue | White | Nchapụ ọcha | Nchapụ ọcha | Nchapụ ọcha | Nchapụ ọcha |
| Akụkụ nke Morphology X | X:S- pherical;B- Curred | ||||||
| Ịkwụsị ions | Amines Organic/Inorganic | ||||||
| Ngwakọta akụrụngwa Y | Y:M-TMOS;E-TEOS;ME-TMOS+TEOS;EM-TEOS+TMOS | ||||||
| Ọdịnaya adịghị ọcha ọla | ≤300pb | ||||||
ngwa
Isi mpaghara ngwa
| Ntuziaka ngwa | Ihe atụ a na-ahụkarị |
| Semiconductor nrụpụta | Chips jikọtara ọnụ (IC) na ihe ndị Semiconductor Ọgbọ nke atọ |
| Optics na Ngosipụta Teknụzụ | Igwe anya, oghere na panel ngosi |
| Ngwaọrụ nchekwa | Platter diski ike na ebe nchekwa 3D NAND flash |
| Nkwakọ ngwaahịa dị elu | Nkwakọ ngwaahịa ọkwa Wafer (WLP), TSV (site na silicon via) |
| Ngwa ndị ọzọ dị elu | MEMS (Sistemụ Micro-Electro-Mechanical) na Ntinye ahụike |
Nkwado nkwenye yinye gburugburu
Semixlab CMP polishing abrasives na-ezute asambodo ụlọ ọrụ semiconductor wee gafee asambodo ISO 14001/45001/9001.
Usoro ngwa ngwa
Ihe eji eme ihe → Abrasive Synthesis (mgbanwe elu) → Slurry Formulation (Filtration/PH correction) → CMP polishing (EPD control) → Post-Clean → Nyocha (AFM/KLA) → Nbudata nzaghachi data
Site na njikarịcha usoro nhazi, Semixlab CMP polishing abrasive enwetawo ọganihu ọganihu n'ọhịa nke ụlọ elu semiconductor integrated circuit, jiri nwayọọ nwayọọ dochie mbubata na ahịa semiconductor, ma tinye ya nke ọma na mmepụta na mmepụta nke LCD, OLED na ogwe ngosi ndị ọzọ. Ọ bụrụ na ịchọrọ inweta akwụkwọ ọcha teknụzụ zuru ezu ma ọ bụ hazie nnwale nlele, biko kpọtụrụ ndị otu nkwado teknụzụ anyị.
asọmpi Advantage
Semixlab CMP polishing abrasive isi uru
a.Freely kemeghi urughuru dayameta na ogo nke urughuru mkpokọta;
b.Monodisperse ahụ na edo urughuru size nkesa;
c.Stable dispersion usoro;
d.Ike mmepụta ihe dị ukwuu na obere mgbanwe dị iche iche-na-batch;
e.Highly kwụsiri ike, eguzogide agglomeration na sedimentation.
anyị Ọrụ
Ụlọ ahịa ngwaahịa Semixlab
Ụlọ ahịa abrasive Semixlab CMP na-egbuke egbuke
